Overview

Qorvo seeks a seasoned Packaging Development Engineer with a robust background in semiconductor packaging development and integration. This role involves leading new packaging technologies and assembly capabilities, with a focus on SMT process expertise and innovation in packaging solutions.

Working Location:

Candidate must be willing to work at Bac Ninh, Bac Giang

Responsibilities

- Develop and integrate new semiconductor packaging technologies.

- Manage technical projects for packaging technology advancement.

- Serve as a lead expert in packaging assembly processes, especially SMT.

- Innovate in package design, processes, and materials for next-generation solutions.

- Offer technical guidance during development phases and address high-volume production challenges.

- Spearhead projects from concept through to qualification and production in collaboration with R&D.

- Support technical customer engagements and problem resolution.

- Drive continuous process improvement (CPI) in packaging and support cross-functional areas.

- Collaborate with offshore assembly, substrate partners, and suppliers.

- Present project updates to executive management and contribute to patent creation.

- Bachelors degree in Mechanical, Microelectronics, or Materials Engineering. Master’s degree in Mechanical, Microelectronics, or Material Engineering preferred .

- 10+ years experience in packaging or semiconductor assembly.

- Strong leadership and project management skills in packaging and assembly tech.

- Expertise in package design and SMT process development.

- Experience with heterogeneous integration, SiP, and various packaging forms.

- Proficiency in technology/assembly process development across SMT, Die Attach, Wire Bond, etc.

- Exceptional communication skills for idea sharing and presenting to large groups.

- Familiarity with high volume manufacturing, ideally in the cellular handset market.

- Solid problem-solving skills; Lean and/or Six Sigma certification is a plus.

- Knowledge of JEDEC, AEC Q100/200, and TS16949 automotive standards.